Teledyne Imaging

This technology session will examine state-of-the art CMOS sensor technology and how these innovations are impacting imaging. Review the latest pixel and ADC structures, 3D-stacking, chip-stacking, nano-imprinting and onboard processing, as well as new techniques in packaging and interfaces, and discover how these increase performance while reducing size and power, unlocking new and exciting applications for imaging. See the benefits of these innovations in the field using our newest Snappy and Emerald series sensors as well as our latest MIPI optical module.
*Originally presented on November 19, 2020 at our New Technology Showcase: Industrial Vision

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